Title | Multi-scale compliant structures for use as a chip-scale dry adhesive |
Publication Type | Conference Paper |
Year of Publication | 2005 |
Authors | Northen MT, Turner KL |
Publisher | IEEE |
Title | Multi-scale compliant structures for use as a chip-scale dry adhesive |
Publication Type | Conference Paper |
Year of Publication | 2005 |
Authors | Northen MT, Turner KL |
Publisher | IEEE |